lm2904-q1 dual operational amplifier slos414f ? may 2003 ? revised april 2008 1 post office box 655303 ? dallas, texas 75265 qualified for automotive applications esd protection exceeds 500 v per mil-std-883, method 3015; exceeds 200 v using machine model (c = 200 pf, r = 0) low supply-current drain independent of supply voltage . . . 0.7 ma typ common-mode input voltage range includes ground, allowing direct sensing near ground differential input voltage range equal to maximum-rated supply voltage: ? non-v devices . . . 26 v ? v-suffix device s... 32 v low input bias and offset parameters: ? input offset voltage ...3 mv typ ? input offset current ...2 na typ ? input bias current . . . 20 na typ open-loop differential voltage amplification . . . 100 v/mv typ internal frequency compensation description/ordering information this device consists of two independent, high-gain, frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages. operation from split supplies is possible as long as the difference between the two supplies is 3 v to 26 v (3 v to 32 v for v-suffix devices), and v cc is at least 1.5 v more positive than the input common-mode voltage. the low supply-current drain is independent of the magnitude of the supply voltage. applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be implemented more easily in single-supply-voltage systems. for example, these devices can be operated directly from the standard 5-v supply used in digital systems and easily provide the required interface electronics without additional 5-v supplies. the lm2904q is manufactured to demanding automotive requirements. ordering information t a v io max at 25 c max v cc package ? orderable part number top-side marking 7 mv 26 v soic (d) tape and reel lm2904qdrq1 2904q1 7 mv 26 v tssop (pw) tape and reel lm2904qpwrq1 2904q1 40 c to 125 c 7 mv 32 v soic (d) tape and reel lm2904vqdrq1 2904vq1 ?40 c to 125 c 7 mv 32 v tssop (pw) tape and reel lm2904vqpwrq1 2904vq1 2 mv 32 v soic (d) tape and reel lm2904avqdrq1 2904avq 2 mv 32 v tssop (pw) tape and reel lm2904avqpwrq1 2904avq ? for the most current package and ordering information, see the package option addendum at the end of this document, or see the ti web site at http://www.ti.com. ? package drawings, thermal data, and symbolization are available at http://www.ti.com/packaging. please be aware that an important notice concerning avail ability, standard warranty, and use in critical applications of texas instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. copyright ? 2008, texas instruments incorporated production data information is current as of publication date. products conform to specifications per the terms of texas instruments standard warranty. production processing does not necessarily include testing of all parameters. 1 2 3 4 8 7 6 5 1out 1in? 1in+ gnd v cc 2out 2in? 2in+ d or pw package (top view)
lm2904-q1 dual operational amplifier slos414f ? may 2003 ? revised april 2008 2 post office box 655303 ? dallas, texas 75265 symbol (each amplifier) in+ in? out + ? schematic (each amplifier) v cc+ out gnd (or v cc? ) to other amplifier in? in+ 6- a current regulator 6- a current regulator 100- a current regulator 50- a current regulator epi-fet diodes resistors transistors capacitors component count 1 2 7 51 2
lm2904-q1 dual operational amplifier slos414f ? may 2003 ? revised april 2008 3 post office box 655303 ? dallas, texas 75265 absolute maximum ratings over operating free-air temperature (unless otherwise noted) ? supply voltage, v cc (see note 1): non-v devices 26 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v-suffix devices 32 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . differential input voltage, v id (see note 2): non-v devices 26 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v-suffix devices 32 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . input voltage range, v i (either input): non-v devices ?0.3 v to 26 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v-suffix devices ?0.3 v to 32 v . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . duration of output short circuit (one amplifier) to ground at (or below) 25 c free-air temperature (v cc 15 v) (see note 3) unlimited . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . operating virtual junction temperature, t j 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . package thermal impedance, ja (see notes 4 and 5): d package 97 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . . . . pw package 149 c/w . . . . . . . . . . . . . . . . . . . . . . . . . . operating free-air temperature range, t a ?40 c to 125 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . storage temperature range, t stg ?65 c to 150 c . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ? stresses beyond those listed under ?absolute maximum ratings? may cause permanent damage to the device. these are stress ratings only, a nd functional operation of the device at these or any other conditions beyond those indicated under ?recommended operating conditi ons? is not implied. exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. notes: 1. all voltage values, except differential voltages and v cc specified for measurement of i os , are with respect to the network ground terminal. 2. differential voltages are at in+ with respect to in?. 3. short circuits from outputs to v cc can cause excessive heating and eventual destruction. 4. maximum power dissipation is a function of t j (max), ja , and t a . the maximum allowable power dissipation at any allowable ambient temperature is p d = (t j (max) ? t a )/ ja . operating at the absolute maximum t j of 150 c can affect reliability. 5. the package thermal impedance is calculated in accordance with jesd 51-7.
lm2904-q1 dual operational amplifier slos414f ? may 2003 ? revised april 2008 4 post office box 655303 ? dallas, texas 75265 electrical characteristics at specified free-air temperature, v cc = 5 v (unless otherwise noted) parameter test conditions ? t a ? min typ max unit v cc =5vto non a devices 25 c 3 7 v input offset voltage v cc = 5 v to max, non-a devices full range 10 mv v io input offset voltage max , v ic = v icr(min) , v 14v a suffix devices 25 c 1 2 mv ic icr(min) v o = 1.4 v a-suffix devices full range 4 v io average temperature coefficient of input offset voltage full range 7 v/ c non v devices 25 c 2 50 i input offset current v 14v non-v devices full range 300 na i io input offset current v o = 1.4 v v suffix devices 25 c 5 50 na v-suffix devices full range 150 i io average temperature coefficient of input offset current full range 10 pa/ c i input bias current v 14v 25 c ?20 ?250 na i ib input bias current v o = 1.4 v full range ?500 na i b drift full range 50 pa/ c v common mode input voltage range v 5vtomax 25 c 0 to v cc ?1.5 v v icr common-mode input voltage range v cc = 5 v to max full range 0 to v cc ?2 v r l 10 k ? 25 c v cc ?1.5 v cc = max, r l = 2 k ? full range 22 v oh high-level output voltage v cc = max , non-v devices r l 10 k ? full range 23 24 v v oh high level output voltage v cc = max, r l = 2 k ? full range 26 v v cc = max , v-suffix devices r l 10 k ? full range 27 28 v ol low-level output voltage r l 10 k ? full range 5 20 mv a lar g e-si g nal differential v cc = 15 v, v o = 1 v to 11 v, 25 c 25 100 v/mv a vd large signal differential voltage amplification v cc = 15 v , v o = 1 v to 11 v , r l = 2 k ? full range 15 v/mv cmrr common-mode rejection ratio v cc = 5 v to max, v ic = v icr(min) 25 c 65 80 db k svr supply-voltage rejection ratio ( ? v dd / ? v io ) v cc = 5 v to max 25 c 65 100 db v o1 /v o2 crosstalk attenuation f = 1 khz to 20 khz 25 c 120 db v 15 v v 1v v 0 25 c ?20 ?30 v cc = 15 v, v id = 1 v, v o = 0 full range ?10 ma i o output current v 15 v v 1v v 15 v 25 c 10 20 ma i o output current v cc = 15 v, v id = ?1 v, v o = 15 v full range 5 v id = ?1 v, v o = 200 mv 25 c 12 40 a i os short-circuit output current v cc at 5 v, gnd at ?5 v, v o = 0 25 c 40 60 ma i cc supply current (two amplifiers) v o = 2.5 v, no load full range 0.7 1.2 ma i cc supply current (two amplifiers) v cc = max, v o = 0.5 v cc , no load full range 1 2 ma ? all characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. m ax v cc for testing purposes is 26 v for non-v devices and 32 v for v-suffix devices. ? full range is ?40 c to 125 c for lm2904q.s all typical values are at t a = 25 c.
lm2904-q1 dual operational amplifier slos414f ? may 2003 ? revised april 2008 5 post office box 655303 ? dallas, texas 75265 operating conditions, v cc = 15 v, t a = 25 c parameter test conditions typ unit sr slew rate at unity gain r l = 1 m ? , c l = 30 pf, v i = 10 v (see figure 1) 0.3 v/ s b 1 unity-gain bandwidth r l = 1 m ? , c l = 20 pf (see figure 1) 0.7 mhz v n equivalent input noise voltage r s = 100 ? , v i = 0 v, f = 1 khz (see figure 2) 40 nv/ hz c l v o v i ? + r l v cc+ v cc? figure 1. unity-gain amplifier v o ? + 100 ? v cc+ v cc? rs 900 ? v i = 0 v figure 2. noise-test circuit
package option addendum www.ti.com 20-oct-2011 addendum-page 1 packaging information orderable device status (1) package type package drawing pins package qty eco plan (2) lead/ ball finish msl peak temp (3) samples (requires login) LM2904AVQDRG4Q1 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim lm2904avqdrq1 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim lm2904avqpwrg4q1 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim lm2904avqpwrq1 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim lm2904qdrg4q1 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim lm2904qdrq1 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim lm2904qpwrg4q1 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim lm2904qpwrq1 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim lm2904vqdrg4q1 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim lm2904vqdrq1 active soic d 8 2500 green (rohs & no sb/br) cu nipdau level-1-260c-unlim lm2904vqpwrg4q1 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim lm2904vqpwrq1 active tssop pw 8 2000 green (rohs & no sb/br) cu nipdau level-1-260c-unlim (1) the marketing status values are defined as follows: active: product device recommended for new designs. lifebuy: ti has announced that the device will be discontinued, and a lifetime-buy period is in effect. nrnd: not recommended for new designs. device is in production to support existing customers, but ti does not recommend using this part in a new design. preview: device has been announced but is not in production. samples may or may not be available. obsolete: ti has discontinued the production of the device. (2) eco plan - the planned eco-friendly classification: pb-free (rohs), pb-free (rohs exempt), or green (rohs & no sb/br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. tbd: the pb-free/green conversion plan has not been defined.
package option addendum www.ti.com 20-oct-2011 addendum-page 2 pb-free (rohs): ti's terms "lead-free" or "pb-free" mean semiconductor products that are compatible with the current rohs requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. where designed to be soldered at high temperatures, ti pb-free products are suitable for use in specified lead-free processes. pb-free (rohs exempt): this component has a rohs exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. the component is otherwise considered pb-free (rohs compatible) as defined above. green (rohs & no sb/br): ti defines "green" to mean pb-free (rohs compatible), and free of bromine (br) and antimony (sb) based flame retardants (br or sb do not exceed 0.1% by weight in homogeneous material) (3) msl, peak temp. -- the moisture sensitivity level rating according to the jedec industry standard classifications, and peak solder temperature. important information and disclaimer: the information provided on this page represents ti's knowledge and belief as of the date that it is provided. ti bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. efforts are underway to better integrate information from third parties. ti has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ti and ti suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. in no event shall ti's liability arising out of such information exceed the total purchase price of the ti part(s) at issue in this document sold by ti to customer on an annual basis. other qualified versions of lm2904-q1 : ? catalog: lm2904 note: qualified version definitions: ? catalog - ti's standard catalog product
important notice texas instruments incorporated and its subsidiaries (ti) reserve the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per jesd46, latest issue, and to discontinue any product or service per jesd48, latest issue. buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. all semiconductor products (also referred to herein as ? components ? ) are sold subject to ti ? s terms and conditions of sale supplied at the time of order acknowledgment. ti warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in ti ? s terms and conditions of sale of semiconductor products. testing and other quality control techniques are used to the extent ti deems necessary to support this warranty. except where mandated by applicable law, testing of all parameters of each component is not necessarily performed. ti assumes no liability for applications assistance or the design of buyers ? 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